The company has invested around US$150 million in the facility which will primarily produce lithography and wet-etch filtration, purification and separation solutions that will help meet the high demand for advanced node semiconductor chips.
"This new facility is not only an important development for advancing semiconductor manufacturing technology, but also an important next step for Pall,” said Naresh Narasimhan, Danaher Group Executive, High Growth Markets & Pall Corporation. “We will continue to leverage our experience and expertise to help solve global challenges, from the increased demand for advanced chips to aiding in the transition to greener manufacturing."
The now-completed seven-acre facility includes more than 18,000 square meters of high-volume manufacturing (HVM) and office space and will integrate core research and development capabilities in the future. The new facility will allow customers in highly demanding industries to meet growing end market demand for data processing and storage.
“Newer applications like generative artificial intelligence (AI), high-performance computing (HPC), next generation communications and autonomous vehicles require cutting-edge semiconductor chips that are made in advanced node fabs,” said Shangaza Dasent, vice president and general manager Microelectronics, Pall Corporation. “The high technology filtration solutions manufactured by this new facility are specifically designed to support the production of these advanced node logic and memory chips.”
