When fully operational, the new facility is expected to more than double Pall’s current production capacity and strengthen its position in Singapore as a regional and global hub for customers in the Asia Pacific region.
“We expect the APAC region will soon outstrip other markets to become an anchor in the global semiconductor industry. Today, APAC accounts for most of the global semiconductor market. With large-scale investments in Singapore, along with Tsukuba, Japan, Pall is well positioned to offer substantial expertise in advanced node solutions and a vast footprint of technologies to serve the growing demands of chip manufacturers in the region,” said Naresh Narasimhan, president of Pall Corp.
The facility will occupy a seven-acre campus that will include more than 18 000 sq m of manufacturing and office space. High-volume manufacturing (HVM) and research and development capabilities are planned to be completed between late 2023 and early 2024, creating up to 300 new jobs.
“The US$100 million investment demonstrates Pall’s commitment to help customers meet extremely challenging defect reduction goals amidst a global chip shortage crisis as new technologies, such as 5G, artificial intelligence and automation, evolve and continue to drive transformation,” added Narasimhan.